Circuit Card Assembly (CCA) and Test

• IPC-A-610, J-STD-001 Class 3 Compliant Products
• Fine Pitch Surface Mount, Through-Hole and Mixed Technology
• Quick Turn Prototypes and Volume Production
• Schematic Capture and PCB Layout CAE Support
• Experienced and Certified Workforce
• 3-Dimensional Paste Inspection Measurement Technology
• Large Field of View (LFOV) X-Ray Inspection with Auto Adjusting in Focal Spot Size and Oblique Viewing
• Selective Soldering with Programmable Flux Deposition, Programmable Solder Flow Rate and Nitrogen Inerting System
• Flying Probe In-circuit Test (ICT)
• Automated Optical Inspection
• Boundary Scan Capable
• Cleanliness testing to MIL-STD-2000A, MIL-P-28809, IPC-TM-650, and J-STD-001B
• Maximum Board Size: 14" x 16"
• BGA Maximum Size: 2.04" x 1.53" 20 mil pitch x 10 mil bump, 10K balls (Standard Resolution)
• BGA Maximum Size: 0.59" x0 .43" 6 mil pitch x 3 mil bump, 10K balls (High-Resolution)
• Minimum 0201 Component
• Max Leaded IC: 2.04" x 2.04, 15 mil pitch x 8 mil lead, 700 Leads (Standard Resolution)
• Max Leaded IC: 0.59" x 0.59", 4 mil pitch x 2 mil lead, 700 Leads (High Resolution)
• Rigid or Flexible Substrates
• CCA Rework per IPC-7711/7721

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Systems | Complex Assembly | Circuit Assembly Wire Assembly | Inspection